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[Analysis Case] Evaluation of Bonding State and Film Thickness of SiC Surface

In addition to detailed condition assessment, film thickness calculation is possible.

XPS can evaluate the chemical bonding state of the sample surface, and further detailed assessments can be made through waveform analysis. Additionally, by using assumed parameters in the waveform analysis results, it is also possible to calculate the thickness of surface oxide films, etc. In this document, we will introduce a case where the composition and state evaluation of the SiC surface was performed, along with the calculation of the oxide film thickness from the obtained peak intensity.

Company：一般財団法人材料科学技術振興財団　MST
Price：Other

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[Analysis Case] Evaluation of Oxidation State of Cu Surface by XPS

Separation of components in the Cu spectrum, quantification, and calculation of film thickness.

From the analysis of the Cu2p3/2 spectrum and Cu Auger spectrum, it is possible to evaluate the bonding state, quantitative assessment, and film thickness of the Cu surface. Major application examples include the evaluation of CMP processing and cleaning of Cu wiring, as well as the investigation of rust and discoloration of Cu electrodes. We will summarize the surface states of Cu treated with various processes and the thickness of the oxide film. (Measurements can be conducted immediately after treatment in a clean room environment.)